Product properties of aluminum nitride AlN powder
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Overview of Aluminum Nitride AlN
Ceramic spherical aluminum nitride was first synthesized in 1877. In the 1980s, AlN ceramic microspheres, as ceramic insulators, were widely used in the field of microelectronics due to their high heat transfer properties. Unlike beryllium oxide, AlN ceramic microspheres are nontoxic. Ceramic spherical aluminum nitride is metallized and can be used as a replacement for aluminum oxide and beryllium oxide in a large number of electronic instruments. Spherical ceramic AlN can be prepared by reducing alumina and carbon or directly nitriding metallic aluminum. Aluminum nitride ceramic microspheres are materials that are linked by covalent bonds. It has a hexagonal crystal structure with the same shape as zinc sulfide and wurtzite. Industrial grade materials can only be made by hot pressing and welding. This material is very stable in inert high temperature environments.
Product properties of aluminum nitride AlN powder
The aluminum nitride powder (CAS 24304-00-5) sold by our company has high purity, ultra-fine particle size and high surface activity. The powder is treated with surface cloth, and the oxygen content is extremely low (<0.1%), thermal insulation and thermal conductivity. The performance effect is obvious.
How is aluminum nitride AlN powder produced?
Thermal Spray Process: Aluminum Nitride powders can be thermally sprayed to form electrically insulating and thermally conductive coatings. Chemical/Physical Vapor Deposition (CVD/PVD): Aluminum nitride coatings are deposited by CVD or PVDto provide an electrically insulating and thermally conductive coating.
Powder Metallurgy (P/M): Aluminum powder is pressed into parts by hot or cold pressing and sintering.
Application of Aluminum Nitride AlN
1. After secondary laser melting and spherical alloying, the obtained AlN ceramic microspheres have uniform size and good fluidity, which improves the thermal conductivity and insulation of the material;
2. After the AlN surface ceramic microspheres are melted, they undergo anti-hydrolysis and anti-oxidation treatment, and the thermal conductivity will exist for a long time after being added.
3. Ceramic spherical aluminum nitride has good injection molding properties; used for composite materials, it has good matching and good interface compatibility with semiconductor silicon, which can improve the mechanical properties and thermal conductivity of composite materials;
4. Application in high thermal conductivity plastics: Modified AlN ceramic microspheres can greatly improve the thermal conductivity of plastics. At present, it is mainly used for PVC plastics, polyurethane plastics, PA plastics, PP plastics, functional plastics, etc.
Aluminum Nitride AlN Ceramic Microspheres Price
The price of aluminum nitride (AlN) ceramic microspheres will change randomly due to factors such as production cost, transportation cost, international situation, exchange rate, market supply and demand of aluminum nitride (AlN) ceramic microspheres. Tanki New Materials Co., Ltd. aims to help industries and chemical wholesalers find high-quality, low-cost nanomaterials and chemicals by providing a full range of customized services. If you are looking for Aluminum Nitride AlN Ceramic Microspheres, please feel free to send an inquiry to get the latest price of Aluminum Nitride AlN Ceramic Microspheres.
Aluminum nitride AlN ceramic microsphere suppliers
As a global supplier of aluminum nitride AlN ceramic microspheres, Tanki New Materials Co., Ltd. has extensive experience in the performance, application and cost-effective manufacturing of advanced engineering materials. The company has successfully developed a series of powder materials (molybdenum disilicide, lanthanum nitride (LaN powder, calcium silicide, iron boride), high-purity targets, functional ceramics and structural devices, and provides OEM services.
|Aluminum Nitride Microsphere Properties|
|Other Names||Aluminium nitride|
|Appearance||White to pale yellow powder|
|Melting Point||2200 °C|
|Boiling Point||2517 °C (dec.)|
|Density||2.9 to 3.3 g/cm3|
|Solubility in H2O||N/A|
|Electrical Resistivity||10 to 12 10x Ω-m|
|Poisson's Ratio||0.21 to 0.31|
|Specific Heat||780 J/kg-K|
|Thermal Conductivity||80 to 200 W/m-K|
|Thermal Expansion||4.2 to 5.4 µm/m-K|
|Young's Modulus||330 GPa|
|Aluminum Nitride Microsphere Health & Safety Information|
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